Coverlay / Bonding Sheet

Basic Information
and Characteristics Tape for FPCB Manufacturing (Excellent Heat Resistant Adhesion, Electrical Insulation, Outstanding Flame Retardancy, Low Dielectric Constant)

This material is used in the manufacturing and assembly processes of electronic products, providing various functions to printed circuit boards (PCBs).

These materials play a crucial role in enhancing functionality and reliability in the manufacturing of electronic products. Coverlay and Bonding Sheet meet various requirements such as flexibility, stability, heat resistance, and electrical properties, optimizing the performance of electronic products.